Applicable Processes

CNC turning: Connector pins, probe station shafts, sensor core components

CNC machining: Semiconductor wafer chucks, fixture bases, heat sinks, precision test jigs

Sheet metal: Server chassis, equipment shielding cases, EMC shielding brackets, cooling cabinet frames

Core Production Requirements

⭐Ultra-precision flatness & parallelism for wafer fixtures; micro-tolerance for tiny electronic connectors

⭐EMC/anti-interference performance: Conductive surface treatment, seamless sheet metal assembly for shielding housings

⭐Low thermal expansion materials: Aluminum alloy, copper alloy for heat sinks to ensure efficient heat dissipation

⭐Burr-free micro features: Tiny grooves, threaded holes, micro slots without metal burrs (burrs cause short circuits)

⭐Dust & static control: Anti-static tooling, dust-free machining environment for semiconductor equipment parts

⭐Thin sheet metal processing: Avoid bending cracking on thin aluminum/copper sheets; precise bending angle tolerance ±0.5°